💻 Technology Aug 29, 2026

SK Hynix breaks ground for its $4B advanced memory chip packaging facility in Indiana, with mass production of next-generation HBM scheduled to begin in H2 2029 (Bloomberg)

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Bloomberg:
SK Hynix breaks ground for its $4B advanced memory chip packaging facility in Indiana, with mass production of next-generation HBM scheduled to begin in H2 2029 — SK Hynix Inc. held a groundbreaking ceremony Thursday for its advanced memory packaging facility in Indiana …

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